Paul's Picks
Sockets Feature Adjustable Pads for Fragile Devices
The 27-mm CSP/MicroBGA Test and Burn-In Sockets now offer an optional adjustable pressure pad for handling very small, fragile devices such as thin or ceramic chips. Each pad comes with a washer stack in 0.001-inch and 0.010-inch increments that serves as a hard stop to eliminate device over-compression.
The sockets have a signal path of 0.077 inch and use solderless pressure-mount compression spring probes located by two molded plastic alignment pins and mounted with stainless steel screws. The operating temperature is -55°C to +150°C, and the estimated contact life is a minimum of 500,000 cycles.
The CSP/MicroBGA socket family accommodates various CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and flash devices. They are available in custom materials, platings, sizes, and configurations.